Dual Cross-Linked Polymethacrylic Acid Hydrogels with Tunable Mechanical Properties and Shape Memory Behavior
Macromolecular Materials and Engineering, cilt.306, sa.9, 2021 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 306 Sayı: 9
- Basım Tarihi: 2021
- Doi Numarası: 10.1002/mame.202100201
- Dergi Adı: Macromolecular Materials and Engineering
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Applied Science & Technology Source, Chemical Abstracts Core, Chimica, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
- Anahtar Kelimeler: dual cross‐, links, hydrogels, hydrogen bonding, mechanical properties, micelle cross‐, linking, shape memory
- Kırklareli Üniversitesi Adresli: Evet
Özet
Herein, a series of poly(methacrylic acid) hydrogels are prepared via bulk polymerization of methacrylic acid (MAAc) and grafting of Triton X-100 (TX-100). One-pot and extremely simple chemistry consist of only mixing and subsequently heating of commercially available monomer and surfactant. The polymer chains are interconnected through dual physical cross-link points formed by the hydrophobic associations in the center of TX-100 micelles and hydrogen bonds stabilized by hydrophobic α-methyl groups of MAAc. The hydrogels exhibit tunable mechanical properties ranging between softness and stiffness by adjusting the surfactant/monomer molar ratio, such as Young modulus of 0.6−22 MPa, elongation at break of 750−1700%, tensile strength of 0.21−3.6 MPa, and compressive strength of 41−93 MPa. The synergistic effect of high-density hydrogen bonds with hydrophobic associations endows a plastic-like hydrogel with high strength and shape memory (SM) behavior, while a high concentration of micelles with low-density hydrogen bonds endows a stretchable elastic hydrogel. The combination of temperature-induced SM property and wide-ranging mechanical performance will make such hydrogels useful in diverse applications.